Softwares
Design Services
  • Analyzing
  • Schematic
  • Foot print creation
  • Board design
  • Component placement
  • Constraint settings
  • Routing
  • Segmentation
  • SI Analysis
  • Fabrication work
  • Output files
  • Quality Check
Schematic
  • Library creation
  • Component placement
  • Connections
  • Part editing
  • Bill Of Material (BOM)
  • Connections report
  • Synchronizing to board
Board design
  • Dimensions
  • Tooling hole marking
  • Cutout details
  • Keep-in & keep-out
  • Planning
  • Routing
  • Controlled impedance board Design
  • Segmentation
  • Reports
Signal Integrity Analysis
  • EMI analysis
  • Reflection Cross talk analysis
  • summary reports
  • Delay report
  • Delay criteria
  • Propagation Delay
  • Switch delay simulation
  • Parasitics Report
  • Power delivery analysis
  • Distortion Criteria
  • Noise margin
  • Post-Route verification
    • Interactive simulation
    • Batch simulation
    • Cross talk analysis
    • EMI analysis
    • Multi board analysis
  • Transmission line simulation
  • Floor planning
  • Topology extraction
  • Power delivery analysis
Output files
  • Board file
  • Schematic file
  • Bill Of  Material
  • Net list report
  • PDF’s for schematic and board
  • Gerber file
Component Placement
  • Space maintenance
  • Package keep-out
  • Sequence of placement
  • Reference designator
 
Analyze
  • Customer input
    • PDF
    • Board files
    • Gerber files
  • Component analyzing
    • Fine pitch (less than 25 mil)
    • Number of pins
  • Net analyzing
Foot print creation
  • Pad generation
  • Pitch maintaining
  • First pin indication
  • Fiducial
  • Component outline
  • Reference designator

Routing
  • Microvias and vialess routing, constraint driven placement and routing, manual routing of critical traces.
  • Close coupling of differential pair with edge coupling and board side coupling.
  • Obeying line angle controls.
    Segment Over Voids (SOV).
  • Length matching.
Segmentation
  • Section wise plane distribution for ground and power for analog digital and mixed signal designs
  • De-coupling techniques for powers

Fabrication work
  • Designing to the latest standards for DFM,DFT and ICT
  • Drill chart with symbols
  • Board dimensioning
  • Counter bore and counter sink details
  • Slot details
  • Stack up details
  • FAB notes
  • Customer logo
  • Title block


Constraint settings
  • Space constraints
  • Differential pair constraints
  • Mask opening details
  • Group matching
  • Pin pairs
  • Non-electrical constrains
 
 
 
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